PC-600 ACID COPPER PLATING PROCESS

PC-600 ACID COPPER PULSE PLATING PROCESS

Product Code:

DESCRIPTION

PC-600 is an acid copper plating additive system that has been specifically optimized for use with pulse periodic reverse rectification on a continual production basis.

READ ENTIRE TECHNICAL DATA SHEET BEFORE USING THIS PRODUCT

FEATURES & BENEFITS

The process produces a fine-grained, ductile deposit with excellent distribution characteristics, and is maintained with two components. The combination of PC-600 and a periodic reverse pulse plating rectifier can significantly shorten plating times while maintaining excellent distribution ratios.

PHYSICAL PROPERTIES

Nominal Deposit Characteristics

Electrical Resistivity

1.68 micro-ohm-cm

Elongation*

Greater than 18%

Internal Stress

750 to 1500 psi

Density

9 g/cc

Ultimate Tensile Strength*

Greater than 36,000 psi

Solderability

Excellent

Microscopic Structure

Fine Grained Equiaxed

*Testing per IPC-TM-650, Method 2.4.18.1

PROCESS COMPONENTS REQUIRED

Product Name Product Code

PC-600 Carrier PC-600 Replenisher

EQUIPMENT

Tanks, pipes, fittings and valves should be acid resistant. All plastic parts should be of Teflon®, PVC, PVDF, polypropylene or high-density polyethylene construction. Soft PVC (e.g. Tygon®) is not recommended for constant contact with the bath.

Anode bars, cathode bars and bus bars should be made of copper. Bolts, fixtures, etc. that are not immersed in the plating solution may be made of copper, bronze, 316 stainless steel or titanium. Metal parts that will be immersed in the plating bath should be constructed of titanium.

Acid copper sulfate solutions are corrosive. It is important to protect the floors, plumbing and any other equipment, which may come in contact with the plating solution. Vinyl coatings, asphalt or several coats of rubber-based paint will usually provide adequate protection.

Rectifier output (amperage) should be calibrated to 土5% or less across the working range. Also the pulse wave form (especially the % overshoot and rise time) should be checked with an oscilloscope by a qualified technician.

The preferred rack materials are copper and copper alloys. The rack area, if immersed in plating solution, should be coated with a non-conductive material (e.g. Plastisol®, Koroseal®).

MAKE UP PROCEDURE

Solution

Copper Sulfate Pentahydrate

65 g/L**

Sulfuric Acid

12.7% by volume (230 g/L H2SO4)

PC-600 Carrier

3% by volume

PC-600 Replenisher

0.20% by volume

Deionized Water

Balance

Chloride

70 ppm

Note: COPPER SULFATE CONCENTRATE from MacDermid Enthone typically contains about 270 g/L (36 oz/gal) of copper sulfate pentahydrate, or 68.7 g/l (17.5 oz/gal) of copper metal.

Mixing Instructions:

Fill to half of final working volume with deionized water.

With mixing, add the required amount of copper sulfate and dissolve.

With heavy mixing, slowly add the required amount of sulfuric acid. The addition of sulfuric acid produces a considerable amount of heat. If PVC structures are present, monitor the temperature of the solution and do not allow it to exceed 49 °C (120 °F).

Cool, with mixing, to 29 °C (85 °F).

Add 0.41 g/L of Manganese Sulfate monohydrate pre-dissolved in DI water (CAS #10034­96-5, tech grade or better).

With mixing, add the required amounts of PC-600 Carrier and PC-600 Replenisher.

Fill to final volume with deionized water and mix.

Check the chloride content of the bath and add sufficient hydrochloric acid to raise the chloride to approximately 80 ppm.